| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily reduce warpage of a solid-state imaging element due to a difference in thermal shrinkage between a circuit substrate and the solid-state imaging element after mounting. <P>SOLUTION: The imaging unit 1 includes a printed substrate 3 on which the solid-state imaging element 2 is mounted and a dummy substrate 4 having the same coefficient of thermal expansion with the printed substrate 3. The dummy substrate 4 is fixed to the solid-state imaging element 2 so as to hold the solid-state imaging element 2 mounted on the printed substrate 3 cooperatively with the printed substrate 3 with the solid-state imaging element 2 interposed therebetween. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
