发明名称 THIN-FILM CAPACITOR
摘要 To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability. The thin-film capacitor comprises: a dielectric layer deposited on a base electrode; an upper electrode layer deposited on the dielectric layer; a terminal electrode including an adhesion layer, a seed layer, and a plating layer; a resin layer for wiring provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode; and a wiring layer provided so as to extend through the resin layer for wiring in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode, wherein a composition of the wiring layer differs from that of the adhesion layer of the terminal electrode, and wherein a reducing power of the wiring layer to the dielectric layer is smaller than that of the adhesion layer.
申请公布号 US2011075319(A1) 申请公布日期 2011.03.31
申请号 US20100876611 申请日期 2010.09.07
申请人 TDK CORPORATION 发明人 OIKAWA YASUNOBU;YANO YOSHIHIKO
分类号 H01G4/008;H01G4/005 主分类号 H01G4/008
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