Arrangement for size-optimized housing shape, has base chip and another chip arranged on main side of base chip and is electrically conducting by contact element

摘要

The arrangement has a base chip (1) and another chip (2) arranged on main side of the base chip and is electrically conducting by a contact element (4). Another contact element (3) is provided for external connection, on or over the main side of the base chip carrying another chip. An independent claim is also included for a method for production of arrangement for size-optimized housing shape.