发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that achieves temperature detection with high response by a temperature detection element, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device includes a diode 7 that is formed on a semiconductor substrate and serves as a temperature detection element to detect abnormal heat generation, and a thermal conduction layer 102 that is formed between the diode 7 and the semiconductor substrate and has a thermal conductivity higher than that of the semiconductor substrate. In this way, heat generated in a heat generating portion can be swiftly and uniformly conducted over the entire temperature detection element composed of the diode 7 with efficiency. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011066184(A) 申请公布日期 2011.03.31
申请号 JP20090215270 申请日期 2009.09.17
申请人 RENESAS ELECTRONICS CORP 发明人 NAKAJIMA KOJI
分类号 H01L29/78;H01L21/336;H01L21/822;H01L21/8234;H01L23/34;H01L27/04;H01L27/06;H01L27/088 主分类号 H01L29/78
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