HEAT RADIATION STRUCTURE OF CONTROL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat radiation structure of a control device, the structure increasing a mounting area of an electronic component and downsizing a printed board while securing heat radiation capability of the electronic component. SOLUTION: A peripheral part 2E of a printed board 2 is sandwiched between a base 31 and a cover 32 to be included in a casing 3; a heat radiation pattern 6 is extended from a mounting region 4P of the printed board 2 for an electronic component 4 to the peripheral part 2E becoming a mounting forbidding zone; and a heat transmission part 7 for transmitting heat from a heat radiation pattern 6 to the base 31 is formed in the peripheral part 2E. COPYRIGHT: (C)2011,JPO&INPIT