| 摘要 |
PROBLEM TO BE SOLVED: To provide a humidity sensor package capable of preventing pollutant or waterdrops in the outside air from adhering onto a humidity sensitive part of a humidity sensor, and to provide a method for manufacturing the humidity sensor package. SOLUTION: In this humidity sensor package formed by sticking and fixing on the same support substrate, a sensor chip substrate on which a humidity sensor having a humidity sensitive part whose capacitance or electric resistance is changed according to a humidity is formed, and an IC substrate for detecting an output change of the humidity sensor, the sensor chip substrate and the IC substrate are covered with a sealing resin, and an outside air introduction opening opened on the package end face, for exposing the humidity sensitive part of the humidity sensor to the outside air is provided between the sealing resin and a humidity sensor formation surface of the sensor chip substrate. COPYRIGHT: (C)2011,JPO&INPIT
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