MOUNTING BOARD AND FAILURE PREDICTING METHOD

摘要

Provided is a mounting board on which a semiconductor package is mounted by a ball grid array by using bumps.  The mounting board has first and second wiring lines which are formed in a region below a corner section of the semiconductor package for the purpose of detecting a change of an electrical resistance value due to disconnection.  Furthermore, the mounting board has electrode pads, and the bumps are formed on the electrode pads.  One of the first and the second wiring lines is connected to the electrode pad, and each of the first and the second wiring lines has a low-strength structure having a rupture strength lower than that of bonding between the mounting board and the semiconductor package.