SPUTTERING DEVICE HAVING A DUAL CHAMBER

摘要

The present invention relates to a sputtering device having a dual chamber. The most salient feature of the present invention is that it is devised in such a way that processing can be carried out on a large-area substrate even in a device which occupies a small space because the space where pressure-adjustment processing has to be carried out is reduced, by dividing the chamber of the sputtering device into a basic chamber and a magnetron chamber and using the sputtering target as part of the dividing wall.