| 摘要 |
THE PRESENT INVENTION IS TO PROVIDE A PROTECTING METHOD FOR A SEMICONDUCTOR WAFER AND AN ADHESIVE FILM FOR PROTECTION OF A SEMICONDUCTOR WAFER WHICH MAKES IT POSSIBLE TO STRAIGHTEN OR AVOID WARPAGE IN A SEMICONDUCTOR WAFER AND TO PREVENT BREAKAGE OF WAFERS DURING CONVEYANCE OF WAFERS EVEN IF THE THICKNESS OF A SEMICONDUCTOR WAFER IS THINNED TO APPROXIMATELY 150 PM OR LESS. THE PRESENT INVENTION PROVIDES A PROTECTING METHOD FOR A SEMICONDUCTOR WAFER IN A STEP OF PROCESSING A SEMICONDUCTOR WAFER COMPRISING A FIRST STEP OF ADHERING AN ADHESIVE FILM FOR PROTECTION OF A SEMICONDUCTOR WAFER IN WHICH AN ADHESIVE LAYER IS FORMED ON ONE SURFACE OF A BASE FILM TO A CIRCUIT-FORMED SURFACE OF THE SEMICONDUCTOR WAFER, A SECOND STEP OF HEATING THE SEMICONDUCTOR WAFER TO WHICH THE ADHESIVE FILM FOR PROTECTION OF THE SEMICONDUCTOR WAFER IS ADHERED, A THIRD STEP OF PROCESSING A NON-CIRCUIT-FORMED SURFACE OF THE SEMICONDUCTOR WAFER BY FIXING THE SEMICONDUCTOR WAFER TO WHICH THE ADHESIVE FILM FOR PROTECTION OF THE SEMICONDUCTOR WAFER IS ADHERED ON A GRINDING MACHINE OR AN ABRASIVE MACHINE, AND A FOURTH STEP OF PEELING THE ADHESIVE FILM FOR PROTECTION OF THE SEMICONDUCTOR WAFER FROM THE SEMICONDUCTOR WAFER.
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