发明名称 |
COPPER ELECTROPLATING COMPOSITION |
摘要 |
The present invention relates to a copper electroplating composition comprising a copper alkanesulf onate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition. |
申请公布号 |
WO2011036076(A2) |
申请公布日期 |
2011.03.31 |
申请号 |
WO2010EP63505 |
申请日期 |
2010.09.15 |
申请人 |
BASF SE;LAI, CHIEN-HSUN;HUANG, TZU-TSANG;YANG, SHAO-MIN;CHAN, CHIAHAO |
发明人 |
LAI, CHIEN-HSUN;HUANG, TZU-TSANG;YANG, SHAO-MIN;CHAN, CHIAHAO |
分类号 |
C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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