| 摘要 |
<p>System in package (1) comprising a substrate (4) having at least a first external layer (2) comprising a first conductive patterned layer (29) and being externally accessible for electrically connecting the system in package (1) to an external electric circuit and a second internal layer (3) comprising a second conductive patterned layer (30) and being covered by the first layer (2) and electronic devices (6) provided on the substrate (4) and electrically connected to external contact pads (7) of the first conductive patterned layer (29), the devices (6) and the first and the second conductive patterned layer (29, 30) being electrically connected such as to form an internal electric circuit provided to be electronically connected to the external electric circuit, the first (2) and the second layer (3) being adjacently positioned, the electronic devices (6) being enclosed in an over mould compound,characterised in that at least one of the devices (6) is electrically connected to at least one hidden contact pad (5) of the second conductive patterned layer (30) which is accessible after removal of a removable strip (8) of the first layer (2).</p> |
