| 发明名称 |
DUAL CURE B-STAGEABLE ADHESIVE FOR DIE ATTACH |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a curable composition that is B-stageable and also does not generate a void. <P>SOLUTION: The curable composition is provided which includes two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second chemistry composition can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011063805(A) |
申请公布日期 |
2011.03.31 |
| 申请号 |
JP20100236234 |
申请日期 |
2010.10.21 |
| 申请人 |
NATIONAL STARCH & CHEMICAL INVESTMENT HOLDING CORP |
发明人 |
BECKER KEVIN HARRIS;KUDER HARRY RICHARD |
| 分类号 |
C09J201/00;C08G59/40;C08J3/24;C09J5/00;C09J11/06;C09J163/00;C09J179/04;H01L21/52;H01L21/58;H05K3/34 |
主分类号 |
C09J201/00 |
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