| 摘要 |
PROBLEM TO BE SOLVED: To reduce warpage of a solid-state imaging element caused by the difference in thermal contraction after mounting, between a circuit board and the solid-state imaging element. SOLUTION: The imaging unit 1 includes a solid-state imaging element 2, a printed board 3 and a protective glass 4. The protective glass 4 includes a plurality of conducting portions 4c connected electrically to the solid-state imaging element 2, to protect an element surface on a light-receiving portion 2a side of the solid-state imaging element 2, while the rigidity of the solid-state imaging element 2 is reinforced. On the printed board 3, the solid-state imaging element 2, to which the protective glass 4 is fitted, is flip-chip mounted. The thermal contraction force of the printed board 3 becomes weaker than the rigidity of the solid-state imaging element 2 that is reinforced by the protective glass 4. COPYRIGHT: (C)2011,JPO&INPIT |
