| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact ultrasonic probe by connecting an ultrasonic transducer and an IC substrate without using a pin-shaped electrode of which the area for formation is expanded. SOLUTION: The ultrasonic probe includes: a plurality of ultrasonic vibrating elements arrayed in a matrix; a backing material for braking the ultrasonic vibrating elements by inserting a plurality of signal leads provided in a protruded manner from the individual ultrasonic vibrating element, in order to transfer electric signals from the ultrasonic vibrating elements; a signal lead pad as a terminal portion of the signal lead provided on a surface of the backing material opposed from the side where the ultrasonic vibrating elements are installed; and an IC substrate on which an integrated circuit for processing electric signals is packaged and which includes a connecting pad connected to the signal lead pad as a terminal portion of a signal line drawn from the integrated circuit. The connecting pad connected to the signal lead pad is provided on a front side and/or a rear side of the IC substrate. Furthermore, a connection member having a connection surface opposed to the signal lead pad as the terminal portion of the signal lead is provided in a first connecting pad. COPYRIGHT: (C)2011,JPO&INPIT
|
