发明名称 |
PHOTORESIST STRIPPING TECHNIQUE |
摘要 |
A method for fabricating an integrated circuit device is disclosed. The method may include providing a substrate; forming a first material layer over the substrate; forming a patterned second material layer over the substrate; and removing the patterned second material layer with a fluid comprising a steric hindered organic base and organic solvent.
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申请公布号 |
US2011076624(A1) |
申请公布日期 |
2011.03.31 |
申请号 |
US20090566762 |
申请日期 |
2009.09.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHIEN-WEI;CHANG CHING-YU |
分类号 |
G03F7/20;G03F7/42 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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