| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor substrate from damaging. SOLUTION: A semiconductor device is manufactured by performing: a step S2 of making a support plate adhere to a first main surface of the semiconductor substrate; a step S3 of grinding a second main surface opposite to the first main surface of the semiconductor substrate to which the support substrate adheres; a step S4 of dicing the semiconductor substrate, together with the support plate from a main surface opposite to the adhesive surface of the support substrate; and a step S5. The step includes mounting the diced semiconductor substrates, to which the support substrate adheres, onto a circuit substrate via a second adhesive; lowering the adhesive strength of a first adhesive by curing the second adhesive; and peeling the diced support plate off the semiconductor substrate that is mounted on the circuit substrate. COPYRIGHT: (C)2011,JPO&INPIT |
