METHOD OF JOINTING A SOLDER BALL AND METHOD OF REPAIRING MEMORY MODULE

摘要

PURPOSE: A method of jointing a solder ball and a method of repairing a memory module are provided to prevent a crack of a semiconductor chip included in a package by selectively heating a junction area of a solder ball. CONSTITUTION: In a method of jointing a solder ball and a method of repairing a memory module, a solder paste is coated at least one of a solder ball(115) and a pad(121). A first material is coated in the solder ball. A second material capable of being reacted with the first material is coated on the pad of a substrate for the solder ball. The solder ball and the pad are bonded by heat which is generated in the reaction between the first and second materials.