发明名称 |
DEVICE AND METHOD FOR COOPER WIRE SETTING CURING IN THE THIN FILM LAY-UP PROGRESS |
摘要 |
PURPOSE: A device and a method for a cooper wire setting curing in a thin film lay-up progress are provided to efficiently perform the curing of a silver paste by setting a copper wire without using a capton tape. CONSTITUTION: In a device and a method for a cooper wire setting curing in a thin film lay-up progress, a copper wire setting device in a layup process sets a copper wire(30) in a cell glass(10). A silver paste dotting unit makes a sliver paste dotted in the cell glass. A copper wire transfer fixing unit transfers the copper wire to be set and fixed. A clamp block heating unit clamps the cell glass and the copper wire at the same time to perform curing. |
申请公布号 |
KR20110032231(A) |
申请公布日期 |
2011.03.30 |
申请号 |
KR20090089624 |
申请日期 |
2009.09.22 |
申请人 |
WOOIL HIGH TECH CO., LTD. |
发明人 |
NAM, JU HYUN |
分类号 |
H01L31/18;H01L31/04 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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