| 发明名称 |
SHEET-LIKE ADHESIVE AND TAPE FOR PROCESSING WAFER |
| 摘要 |
<p>PURPOSE: A sheet-like adhesive containing a chelate-modified epoxy is provided to ensure storage of materials, high production efficiency, and little deterioration of adhesive force. CONSTITUTION: A sheet-like adhesive comprises a hardening resin cured by heat or high energy beam and an epoxy hardener for hardening an epoxy. A part or the whole of the hardening resin is a chelate-modified epoxy resin, wherein the chelate-modified epoxy resin is included in the amount of 10 mass % or more. A tape for processing a wafer is such that the sheet-like adhesive(12) applied to the adhesive layer of an adhesive film.</p> |
| 申请公布号 |
KR20110033065(A) |
申请公布日期 |
2011.03.30 |
| 申请号 |
KR20100092266 |
申请日期 |
2010.09.20 |
| 申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
ISHIGURO KUNIHIKO;MORISHIMA YASUMASA;ISHIWATA SHINICHI |
| 分类号 |
C09J163/00;C09J7/02;C09J133/04;H01L21/58 |
主分类号 |
C09J163/00 |
| 代理机构 |
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