A MANUFACTURING METHOD OF A SEMICONDUCTOR FLEXIBLE PRINTED CIRCUIT

摘要

PURPOSE: The manufacturing method of the semiconductor flexible printed circuit board. The water gilding is used and catalyst applies the process. CONSTITUTION: The impurity which is attached to the surface of the polyimide film or is formed is eliminated. Etching is enforced to the polyimide film to etchant and the surface of the polyimide film is reformed. It reacts in the surface of the reformed polyimide film to the coupling solution and it aciditifies.