| 摘要 |
1,258,124. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 28 March, 1969 [2 April, 1968], No. 16437/69. Heading H1K. A semi-conductor circuit arrangement comprises a number of diodes 1-4 enclosed within a common plastics envelope (not shown), a number of parallel terminal leads 5-8 extending out of the envelope, and supply leads 10 interconnecting each diode to its corresponding terminal leads and lying transverse to the portion of the respective terminal leads to which they are connected. The embodiment comprises a bridge rectifier circuit, and each diode 1-4 may be enclosed in its own plastics envelope prior to assembly. The supply leads 10 and terminal leads 5-8 are preferably of Cu, being bonded by resistance welding, the latter leads being sturdy enough to conduct heat away from the assembly and to serve as plug-in connections for a printed circuit board. |
