| 摘要 |
The wire saw for sawing a work piece, e.g. to make silicon wafers for electronic applications, has two or more sawing fields (10, 20) each having a number of saw wires (11, 21) stretched between respective wire guiding cylinders (3, 4; 5, 6). The sawing fields are disposed one above the other. A first sawing field (10) includes deflection rollers (7) for deflecting slack sides (14) of its saw wires that face a second sawing field (20). The slack sides (14) of the saw wires of the first sawing field are guided over the deflection rollers (7) so as to deflect the saw wires and thus increase distances of their slack sides (14) to sawing sides (23) of the saw wires of the second sawing field (20). |
