发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a passive element-contained wiring board and its manufacturing method which has an insulation layer, a conductor circuit pattern provided on the insulation layer, and a resistance element composed of resistance element electrodes and a resistance body forming a part of the conductor circuit pattern, wherein the shape of the resistance body is easily designed and the resistance value variation after forming is a little. <P>SOLUTION: The passive element-contained wiring board has a resistance element. At least one resistance body of the element is connected to resistance element electrodes only at their end faces. The resistance element manufacturing method comprises at least a step of forming openings in a resist layer so as to expose only the end face of the resistance element electrodes of a part of the conductor circuit pattern as a part for providing the resistance body, a step of filling a resistance paste in the resist layer openings, and a step of removing the resistance paste extruded over the thickness of the resist layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP4661351(B2) 申请公布日期 2011.03.30
申请号 JP20050146453 申请日期 2005.05.19
申请人 发明人
分类号 H05K1/16;H05K3/46 主分类号 H05K1/16
代理机构 代理人
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