发明名称 COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF
摘要 <p>COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL,MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102), wherein the 20 degree C storage elastic modulus of the cured resin composition (102) is 100-2000MPa. The composite (100) optionally contains perforations (103). (Figure 1)</p>
申请公布号 SG169322(A1) 申请公布日期 2011.03.30
申请号 SG20100070563 申请日期 2006.04.21
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TAKANO, NOZOMU;KAMIYA, MASAKI
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