发明名称 |
COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF |
摘要 |
<p>COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL,MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102), wherein the 20 degree C storage elastic modulus of the cured resin composition (102) is 100-2000MPa. The composite (100) optionally contains perforations (103). (Figure 1)</p> |
申请公布号 |
SG169322(A1) |
申请公布日期 |
2011.03.30 |
申请号 |
SG20100070563 |
申请日期 |
2006.04.21 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKANO, NOZOMU;KAMIYA, MASAKI |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|