发明名称 |
METHOD FOR MAKING AN ELECTRONIC ASSEMBLY |
摘要 |
<p>In an embodiment of the present invention a method for making an electronic assembly is provided. The method comprises positioning a substrate having a plurality of segmented portions. A first segmented portion has a first plurality of conductive traces terminating to form a first plurality of conductive pads. A second segmented portion has a second plurality of conductive traces terminating to form a second plurality of conductive pads. A flex circuit is placed onto the conductive pads. The flex circuit includes a third plurality of conductive traces terminating at a first end to form a first plurality of connecting pads and terminating at a second end to form a second plurality of connecting pads. Electronic components are electrically coupled to the first and second plurality of conductive traces to form a primary PCB and a daughter PCB. The connecting pads are electrically coupled to the conductive pads for electrically coupling the daughter PCB to the primary PCB.</p> |
申请公布号 |
EP2301065(A1) |
申请公布日期 |
2011.03.30 |
申请号 |
EP20080781939 |
申请日期 |
2008.07.17 |
申请人 |
AUTOLIV ASP, INC. |
发明人 |
STILL, CHARLES;STOSCUP, DAVID, R. |
分类号 |
H05K1/14;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|