发明名称 |
SPUTTERING APPARATUS HAVING DUAL CHAMBER |
摘要 |
PURPOSE: A sputtering apparatus with a dual chamber is provided to save necessary energy for pressure adjustment by the reduction in a space which a pressure controller processes. CONSTITUTION: A sputtering apparatus with a dual chamber comprises a substrate chamber(204), a magnetron chamber(202), a sputtering target(270), and a pressure controller(290). The substrate is loaded into the substrate chamber. The magnetron is installed in the magnetron chamber. The sputtering target is formed between the substrate chamber and the magnetron chamber. The pressure controller adjusts the pressure of the magnetron chamber differently.
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申请公布号 |
KR20110032710(A) |
申请公布日期 |
2011.03.30 |
申请号 |
KR20090090338 |
申请日期 |
2009.09.24 |
申请人 |
AP SYSTEMS INC. |
发明人 |
LEE, CHUN SOO;KANG, WON GU;LEE, DAE JONG;CHOI, DAE KEON |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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