发明名称 Selective soldering system
摘要 A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
申请公布号 US7913894(B2) 申请公布日期 2011.03.29
申请号 US20090556955 申请日期 2009.09.10
申请人 SONY CORPORATION;SONY ELECTRONICS INC. 发明人 ALVAREZ SERRANO ESTEBAN ARTURO;FONSECA JULIAN MARTINEZ;MILLAN SANCHEZ HORMAN ARMANDO
分类号 B23K1/08 主分类号 B23K1/08
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