发明名称 Mixed lithography with dual resist and a single pattern transfer
摘要 An inorganic electron beam sensitive oxide layer is formed on a carbon based material layer or an underlying layer. The inorganic electron beam sensitive oxide layer is exposed with an electron beam and developed to form patterned oxide regions. An ultraviolet sensitive photoresist layer is applied over the patterned oxide regions and exposed surfaces of the carbon based material layer, and subsequently exposed with an ultraviolet radiation and developed. The combined pattern of the patterned ultraviolet sensitive photoresist and the patterned oxide regions is transferred into the carbon based material layer, and subsequently into the underlying layer to form trenches. The carbon based material layer serves as a robust mask for performing additional pattern transfer into the underlying layer, and may be easily stripped afterwards. The patterned ultraviolet sensitive photoresist, the patterned oxide regions, and the patterned carbon based material layer are subsequently removed.
申请公布号 US7914970(B2) 申请公布日期 2011.03.29
申请号 US20070867428 申请日期 2007.10.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FULLER NICHOLAS C.;GUILLORN MICHAEL A.;PRANATHARTHI HARAN BALASUBRAMANIAN S.;PATEL JYOTICA V.
分类号 G03C5/00 主分类号 G03C5/00
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