发明名称 |
Flexible interconnect pattern on semiconductor package |
摘要 |
An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
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申请公布号 |
US7915081(B2) |
申请公布日期 |
2011.03.29 |
申请号 |
US20060395549 |
申请日期 |
2006.03.31 |
申请人 |
INTEL CORPORATION |
发明人 |
TOMITA YOSHIHIRO;CHAU DAVID;CHRYSLER GREGORY M.;NATEKAR DEVENDRA |
分类号 |
H01L21/00;H01L21/44 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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