| 发明名称 |
Integrated circuit package system with leadframe array |
| 摘要 |
An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.
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| 申请公布号 |
US7915716(B2) |
申请公布日期 |
2011.03.29 |
| 申请号 |
US20070862406 |
申请日期 |
2007.09.27 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D.;TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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