发明名称 |
Wiring board manufacturing method, semiconductor device manufacturing method and wiring board |
摘要 |
A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and has a structure in which insulating layers of a first layer 122, a second layer 124, a third layer 126 and a fourth layer 128 are provided. The first layer 122 has a first insulating layer 121 and a second insulating layer 123. A protruded portion 132 which is protruded in a radial direction (a circumferential direction) from an outer periphery at one surface side of a first electrode pad 130 is formed on a whole periphery over a boundary surface between the first insulating layer 121 and the second insulating layer 123.
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申请公布号 |
US7915088(B2) |
申请公布日期 |
2011.03.29 |
申请号 |
US20080099322 |
申请日期 |
2008.04.08 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KOBAYASHI KAZUHIRO;NAKAMURA JUNICHI;KANEKO KENTARO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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