发明名称 HOT MELT PRESSURE-SENSITIVE ADHESIVES FOR PAPER LABELS
摘要 FIELD: chemistry. ^ SUBSTANCE: invention relates to a composition of a hot melt pressure-sensitive adhesive (HMSPA), a laminated system and a pressure sensitive label containing said adhesive. The HMSPA composition contains: a) 30-50% mixture of styrene diblock- and triblock-copolymers, total content of the styrene monomer in the said mixture between 14 and 40%; b) 40-55% tackifying resin with melting point between 70 and 150C, obtained through hydrogenation, polymerisation or copolymerisation of mixtures of aliphatic unsaturated hydrocarbons containing approximately 5, 9 or 10 carbon atoms; c) 4-20% hydrocarbon coil containing less than 15% aromatic compounds; d) 1-6% filler selected from calcium carbonate or a homopolymer or a copolymer polyethylene with low molecular weight. The laminated system includes an adhesive layer consisting of HMPSA and a paper front material. The pressure sensitive label is made from the laminated system. ^ EFFECT: HMPSA composition provides low susceptibility to decolouration during storage of articles. ^ 15 cl, 11 ex
申请公布号 RU2415171(C2) 申请公布日期 2011.03.27
申请号 RU20090114362 申请日期 2007.12.14
申请人 BOSTIK S.A. 发明人 GUBAR DAVID;KHEJEDZHER ROBERT DZHON
分类号 C08L53/02;C09J153/02 主分类号 C08L53/02
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