METHOD AND DEVICE FOR DETACHING A COMPONENT WHICH IS ATTACHED TO A FLEXIBLE FILM

摘要

A releasing process for a glued component on a flexible film, especially a semiconductor chip on a wafer film, comprises sucking the film (2) against a support (6) on a detaching tool (5). A section (8) of the support surface can be displaced when detaching begins while the component (1) is held by a suction tool (4). An independent claim is also included for a device released by the above process.