| 摘要 |
PROBLEM TO BE SOLVED: To suppress a leak of an electrolyte in a chip-type electric double layer capacitor due to heat in a reflow step. SOLUTION: A package structure of the chip-type electric double layer capacitor includes a lower package 110, which houses an electric double layer element and has package terminals 111a, 111b formed on a lower surface to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package 110 and seals the electric double layer element from the outside, wherein the package terminals 111a, 111b are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package 110, and the external bottom surface of the lower package 110 has at least two pairs of protrusions 112a to 112d formed thereon. COPYRIGHT: (C)2011,JPO&INPIT
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