| 摘要 |
PROBLEM TO BE SOLVED: To promote heat dissipation of heat generation units by cooling by a plurality of heat generation units such as ICs by using a limited small space even at a place where the flow of cooling wind fails by the other electronic elements or electronic components or ventilation cannot be ensured far from a fan. SOLUTION: The heat sink module includes: a heat sink unit 10 provided with a heat sink 11 and retaining pieces 14 wherein a heat generation unit 11 is piled up in face-contact manner; a support 20 provided with a plurality of fitting units 21 wherein a plurality of heat sink units 10 are freely removable; a fixing mechanism 30 for fitting the heat sink units 10 to the fitting units 21 of the support 20; and a fixing mechanism 40 for mounting the support 20 onto a circuit board 70. Another heat sink 50 can be additionally provided to the heat sink unit 10. COPYRIGHT: (C)2011,JPO&INPIT
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