发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CIRCUITRY STACKING AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a lead to include a first tip at one end, a second tip on the end opposite from the first tip with a connect area between each end located above the first tip, and a first tier section or a second tier section located between the connect area and the second tip; connecting a bottom component assembly to the first tier section or the second tier section; connecting a top component assembly over the connect area; and applying an encapsulant over and under the connect area with the first tip exposed.
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申请公布号 |
US2011068447(A1) |
申请公布日期 |
2011.03.24 |
申请号 |
US20090562722 |
申请日期 |
2009.09.18 |
申请人 |
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发明人 |
CAMACHO ZIGMUND RAMIREZ;CAPARAS JOSE ALVIN;TRASPORTO ARNEL SENOSA |
分类号 |
H01L23/495;H01L21/50;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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