| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for an optical semiconductor element housing package which has superior solder heat resistance, long term high temperature heat resistance and photodegradation resistance, and can impart good light reflectivity. <P>SOLUTION: In an insulating resin layer 3 for the optical semiconductor element housing package having a recess in which a metal leadframe 1 and an optical semiconductor element 2 mounted thereon are housed, the material forming the insulating resin layer 3 includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 in terms of weight ratio (C)/(D): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler. <P>COPYRIGHT: (C)2011,JPO&INPIT |
