发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING MOLDING USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To solve such a problem in conventional technique that a mold release agent has to be applied to a mold almost every time upon molding in order to secure sufficient mold releasability, so that a molding cycle is prolonged due to effort and time for applying the mold release agent. SOLUTION: The epoxy resin composition contains 0.1-10 pts.mass of an epoxy resin having structure (I) relative to 100 pts.mass of an epoxy resin. The prepreg comprises the epoxy resin composition and reinforcing fibers. In a method for producing a molding, the prepreg comprising the epoxy resin composition and the reinforcing fibers is heated and pressurized for 1-20 minutes in a preheated mold and cured. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011057770(A) |
申请公布日期 |
2011.03.24 |
申请号 |
JP20090206593 |
申请日期 |
2009.09.08 |
申请人 |
MITSUBISHI RAYON CO LTD |
发明人 |
SUZUMURA YASUSHI;AKIYAMA KOICHI;KAZAHAYA YUJI;FURUYA SHINICHIRO;KINOSHITA SANAE;WAKABAYASHI KATSUMI |
分类号 |
C08L63/00;C08G59/40;C08J5/24;C08K5/1515 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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