| 摘要 |
PROBLEM TO BE SOLVED: To provide a solution for adding catalysts for plating an insulating part of a printed wiring board, a package substrate, an ornament, or the like and to provide an electroless plating and a direct plating using the same. SOLUTION: The solution for adding catalyst for plating an insulating part of an article to be plated having the insulating part includes a water-soluble palladium compound, a reducing agent, a dispersing agent, catechol, a copper antioxidant, and a buffer and has a pH of 4 or more. Since the inventive solution is a colloidal solution which contains only Pd and does not contain Sn, compared with a Pd-Sn colloidal solution, it has the following advantages: pre-dip treatment and Sn-removing treatment are not required, allowing simplification of catalyst-imparting treatment; haloing is not formed because pH is 4 or more; and since the a solution for adding catalyst provides a reducing atmosphere with the reducing agent in the solution, a copper surface is not oxidized and copper dissolution does not arise, thereby preventing a palladium displacement reaction. COPYRIGHT: (C)2011,JPO&INPIT |
