| 摘要 |
PROBLEM TO BE SOLVED: To provide a package with an electronic component which realizes miniaturization and enhances the operation reliability of the electronic component. SOLUTION: A body 6, which is a resin, expands thermally due to change in the open-air temperature (temperature increase, to be precise). Since the resin material has a thermal expansion coefficient higher than that of a metal, etc., the body 6 shows a large thermal distortion caused by thermal expansion. The thermal expansion of the body 6 applies an external force to a lead frame 8 fixed to the body 6. In response to this external force, an easing portion 11 formed on an electronic component 10a of the lead frame 8 deforms elastically, which prevents the external force from propagating to the electronic component 10a. This suppresses the occurrence of trouble of the electronic component 10a, thus enhance the operation reliability of the electronic component 10a. Such a configuration allows dispensing with a printed board, thus realizing miniaturization of a current sensor, at the same time. COPYRIGHT: (C)2011,JPO&INPIT |
