发明名称 PLACING CONDITION ABNORMAL CONDITION DETECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable to relatively easily remove a wire from an article while suppressing damage to the wire or a wire supporting member when the wire is pulled. SOLUTION: This placing condition abnormality detecting device 30 is provided for detecting the abnormality of the placing condition of an article to be placed on a transfer device. The placing condition abnormality detecting device 30 includes the wire 31 set outside a region through which the article having a prefixed size passes when carried into/out of the transfer device in a predetermined condition, a winding part 32 for winding the wire 31 at least at one end on a winding member to impart tension to the wire 31, and a detecting part 33 for detecting the movement of the wire 31 when pulled out of the winding part 32 to detect the abnormality of the placing condition of the article. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011057368(A) 申请公布日期 2011.03.24
申请号 JP20090208604 申请日期 2009.09.09
申请人 MURATA MACHINERY LTD 发明人 SARADA MASATO
分类号 B65G1/00 主分类号 B65G1/00
代理机构 代理人
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