| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base array having terminals and an open region; attaching a coverlay layer directly on the base array; placing a component in the open region and directly on the coverlay layer; forming an encapsulation over the base array and the component; removing the coverlay layer to leave a plane of the terminals and a plane of the component partially exposed and substantially coplanar; and removing a portion of the base array between the terminals, the terminals electrically isolated.
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