发明名称 MICROMECHANICAL SYSTEM
摘要 A micromechanical system includes a substrate, a first conductive layer situated above the substrate and a second conductive layer situated above the first conductive layer. The first conductive layer and the second conductive layer are conductively interconnected by a connecting element. The connecting element has a conductive edge surrounding a nonconductive region.
申请公布号 US2011068419(A1) 申请公布日期 2011.03.24
申请号 US20100873912 申请日期 2010.09.01
申请人 REINMUTH JOCHEN;FREY JENS;BIERHOFF CHRISTIAN 发明人 REINMUTH JOCHEN;FREY JENS;BIERHOFF CHRISTIAN
分类号 H01L29/84;H01L21/02 主分类号 H01L29/84
代理机构 代理人
主权项
地址
您可能感兴趣的专利