| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor corresponding to lead-free solder, giving a cured product having excellent solder crack resistance, high temperature stability and moisture resistance reliability; and to provide a semiconductor device using the composition and a method for mounting the device. SOLUTION: The composition prepared by formulating (a) an epoxy resin, (b) an epoxy resin-curing agent and (c) an inorganic filler as essential components, and provides the cured product having a relative humidity of 85% at 85°C, moisture absorptivity of≤0.2% for 72 hours and weight loss of≤0.5% for 5 hours at 240°C in the air. The resin-sealed semiconductor device for mounting lead-free solder with use of the composition and the method for mounting the device are also provided. COPYRIGHT: (C)2011,JPO&INPIT |
