| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating of a printed wiring board for plating-filling of non-through-holes and through-holes and for a film plating over the surface to be plated. SOLUTION: In areas in contact with insulative bodies 20A and 20B, the growth of an electroplating film 36 is retarded. In other words, iron ions are forcibly fed into the plating interface by the insulative bodies 20A and 20B, and then a reduction reaction in which trivalent iron ions are converted into divalent iron ions takes place to suppress the deposition of copper. Within a through-hole 31a not in contact with the insulative bodies 20A and 20B, trivalent iron ions merely diffuse into the plating interface and not forcibly fed there, the reduction reaction of trivalent iron ions is slow, and the electroplating film 36 grows to fill a through-hole conductor 42 and to form a thin electroplating film 36 on the surface of a core substrate. COPYRIGHT: (C)2011,JPO&INPIT
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