THERMALLY-CONDUCTIVE ORGANIC ADDITIVE, RESIN COMPOSITION, AND CURED PRODUCT

摘要

Disclosed is a thermally-conductive organic additive that is an organic polymer differing from conductive inorganic fillers such as ceramic, metal, and carbon materials, is capable of imparting thermal conductivity by being added to plastics, can be lightened in weight without reducing the mold wear and electrical insulation properties of a composition even when added to a resin in large amounts, and has excellent composition molding properties. The thermally-conductive organic additive has a main chain, which mainly comprises repeating units represented by the following general formula (1), is formed mainly in a chain structure, and uses a liquid crystal thermoplastic resin with a simple resin thermal conductivity of at least 0.45 W/(mK). (1) -M-Sp- (M represents a mesogenic group, and Sp represents a spacer.)