| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus and an exposure method that keep exposure precision in one wafer uniform by suitably processing fine vibration generated in a driving direction of a wafer stage. <P>SOLUTION: The exposure apparatus includes: an original plate stage configured to hold an original plate; a substrate stage configured to hold a substrate and to move; a projection optical system configured to project a pattern of the original plate on the substrate; a position measuring means of measuring the position of the substrate stage; and a control means of controlling driving of the substrate stage based upon a measured value of the position measuring means, wherein the substrate is exposed to the pattern of the original plate in a step-and-repeat manner. When the control means drives the substrate stage toward an exposure position to position the substrate, the control means corrects the driving position of the substrate stage based upon at least one of deviation amounts of a target position, magnification, and rotation in the driving direction of the substrate stage (S103 to S107). <P>COPYRIGHT: (C)2011,JPO&INPIT |
