发明名称 ELECTROPLATING EQUIPMENT AND ELECTROPLATING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electroplating equipment and an electroplating method, capable of adjusting dissolved oxygen concentration in a plating liquid and reducing cost due to filter exchange. <P>SOLUTION: The electroplating equipment 11 comprises: a plating tank 13 for holding the plating solution; and a separate tank 15 apart from the plating tank 13, wherein the plating solution circulates between the plating tank 13 and the separate tank 15. The separate tank 15 contains a first space 17 and a second space 19 located downstream from the first space 17. The plating solution in the first space 17 exceeding a prescribed height flows from the first space 17 into the second space 19, and the plating solution falls through air in the second space 19. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011058034(A) 申请公布日期 2011.03.24
申请号 JP20090207286 申请日期 2009.09.08
申请人 C UYEMURA &amp, CO LTD 发明人 ISONO TOSHIHISA;TACHIBANA SHINJI;OMURA NAOYUKI;HOSHI SHUNSAKU;MATSUDA KANAKO;SHIMIZU KOJI
分类号 C25D17/00;C25D3/38;C25D21/18 主分类号 C25D17/00
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