CONNECTION STRUCTURE, POWER MODULE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide high-reliability connection technique that achieves sufficient connection strength and suppresses pad breakage when a lead terminal is connected to a pad of a substrate in an ultrasonic manner. SOLUTION: A coating layer 14, which is harder than the pad 8 and lead terminal 11, is formed on the pad 8 on a metal base 9 and an insulating film 8. During the ultrasonic connection, an ultrasonic wave is applied to an ultrasonic tool 13 to break the coating layer 14, and the lead terminal 11 and pad 10 on both sides of the coating layer 14 are connected directly to each other through plastic flowing. COPYRIGHT: (C)2011,JPO&INPIT