| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the same. <P>SOLUTION: This printed circuit board includes: a laminate including a first insulating layer having a second layer circuit pattern and a third layer circuit pattern which are embedded therein, a second insulating layer formed with the first insulating layer sandwiched and having a first layer circuit pattern formed thereon, and a third insulating layer having a fourth layer circuit pattern formed thereon; and a conductive via for electric connection of the circuit patterns. The conductive via includes a first conductive via for coupling the first layer circuit pattern to the second layer circuit pattern, a second conductive via for coupling the first layer circuit pattern to the third layer circuit pattern, a third conductive via for coupling the second layer circuit pattern to the fourth layer circuit pattern, a fourth conductive via for coupling the third layer circuit pattern to the fourth layer circuit pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
